发明名称 |
Reinforcement Structure and Method for Controlling Warpage of Chip Mounted on Substrate |
摘要 |
A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die. |
申请公布号 |
US2016315057(A1) |
申请公布日期 |
2016.10.27 |
申请号 |
US201615202462 |
申请日期 |
2016.07.05 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Hou Shang-Yun;Hsieh Cheng-Chieh;Lin Tsung-Shu |
分类号 |
H01L23/58;H01L23/31;H01L23/492 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a substrate; a die mounted on the substrate; a reinforcement plate having a periphery and a center region, the reinforcement plate being continuous from a top leftmost corner of the periphery to a bottom rightmost corner of the periphery through the center region; and an adhesive layer bonding the reinforcement plate to the die. |
地址 |
Hsin-Chu TW |