| 摘要 |
PROBLEM TO BE SOLVED: To decrease the dead space of a mounting area by connecting together a wiring pattern, electrode of semiconductor chip and electrode for external connection, and by using connecting means capable of forming a space between a semiconductor substrate and the semiconductor chip, thereby making a metal lead terminal and a sealing mold resin unnecessary. SOLUTION: This semiconductor device is constituted of a semiconductor chip 60, a plurality of electrodes 70 for external connection, a second semiconductor substrate 110 as a wiring substrate, and a first and a second bump electrodes 90, 100 as connecting means. First and second bumps 90, 100 are used for forming a predetermined space by connecting the electrode of the semiconductor chip 60 to an external connection electrode 70. The external connection electrode 70 is connected to a connecting electrode for the semiconductor chip 60, is arranged adjacent to at least one periphery of the semiconductor chip 60 and is separated at a predetermined interval and formed from a semiconductor substrate different from the semiconductor chip 60. Also, the second semiconductor substrate 110 which is to become a wiring substrate has a wiring pattern 81 on its top surface. |
