| 摘要 |
PROBLEM TO BE SOLVED: To realize a production method for non-contact IC card where nonwoven fabric can be fixed in the case of a method to insert the nonwoven fabric, where an antenna coil and an IC chip are inserted, between front and rear sheets. SOLUTION: One sheet 14 is inserted into a cavity 4 of a fixed mold 2 and a fixing pin 15 is inserted through a positioning hole 12, and the other sheet 13 is inserted into a cavity 5 of a mobile die 3, and nonwoven fabric 16 where the antenna coil and the IC chip are inserted is inserted between both sheets 13 and 14, and sheets 13 and 14 are subjected to vacuum suction and the mobile die 3 and the fixed die 2 are closed. And the fixing pin 15 on the fixed die 2 side is pressed to the nonwoven fabric 15 facing the positioning hole 12 of the sheet 13 on the mobile die 2 side to fix it, and fused resin 17 is injected to a space between sheets 13 and 14. |
