| 摘要 |
PROBLEM TO BE SOLVED: To obtain a contactless semiconductor card which has high operation reliability, does not have the drop of product value, has a stable communication characteristic in each product and also has an excellent handling property by burying a substrate in an almost central position in the thickness direction of a card substrate. SOLUTION: A substrate 2 on which a memory IC 1a and a CPU 1b are mounted is completely buried in a card base body 3 and a laminated film 5 is adhered to both front and rear faces of the base body 3. The base body 3 consists of a 1st formed part 3a which holds an electronic part and the substrate 2 at an almost central position in a thickness direction and a case-shaped 2nd formed part 3b in which a battery 4 for the substrate 2 is enclosed. That is, the substrate 2 is buried at an almost central position in the thickness direction of the base body 3. Therefore, internal stress caused by curing contraction becomes almost equal on both front and rear faces of the substrate 2. Thus, a mechanical bad effect on the substrate 2 and the electronic part mounted on it is reduced and then, operation reliability is improved. |
