Compact assembly forming component of image sensor, stacks and interconnects image sensor chip, integrated circuit and substrate on PCB

摘要

On the first of the substrate (10) main surfaces (12, 14) signal input connections (16) are provided. The second surface has outputs (18) connecting the substrate to a PCB (20). An integrated circuit (22) mounted on the first substrate surface is connected to the inputs. An image sensor chip (26) located above the integrated circuit, completes the stacked arrangement and is connected to the substrate signal inputs (16). The sensor chip receives the optical image through a transparent layer (36). Electrical signals from the conversion are sent to the substrate.