| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To transfer effectively heat generated in heated components to the case wall of a radiating portion without being influenced by an arrangement of components, even in an electronic apparatus wherein heated electronic components are packed in a narrow space together with other components. <P>SOLUTION: The electronic apparatus includes a heat receiving portion 14 which transfers the heat of the electronic components 1 to be cooled through an inside liquid flow route, a radiating portion 16 having a liquid flow route inside, and a liquid driving device 40 arranged in a circulating route 18 connecting the heat receiving portion 14 and the radiating portion 16. The radiating portion 16 and the liquid driving device 40 are mounted on the predetermined position on a base, and the heat receiving portion 14 is connected to the outside of the base through the circulating route 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
