| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a slurry having long usable time, not limited by the presence of a metal catalyst, and having high removal rate by solving a problem in conventional oxidizer, complex compound, and metal catalyst using CMP for polishing a nickel-based hard disk film wherein the metal catalyst contributes to the decomposition of the oxidizer to remarkably shorten the usable time of the slurry. <P>SOLUTION: The composition of the slurry for flattening a nickel or nickel alloy film on a base material, for example, a nickel film on a memory hard disk comprises at least two types of oxidizers, abrasives, and water, and does not include the metal catalyst. The composition is effective for polishing the film of the nickel (Ni) and nickel alloy formed in manufacturing the memory hard disk. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
