| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive polyimide resin composition capable of giving a pattern with high sensitivity and high contrast as well as showing excellent electric characteristics or the like of a coating film after cured. <P>SOLUTION: The photosensitive polyimide resin composition comprises a polyimide precursor prepared from a carboxylic acid dianhydride and diamine, and a diazonaphthoquinone compound, wherein 5,5'-(1,1,3,3-tetramethyl-1,3-disiloxane diyl)-bis-norbornen-2,3-dicarboxylic acid dianhydride is used as the carboxylic acid dianhydride. <P>COPYRIGHT: (C)2007,JPO&INPIT |
