APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

摘要

An apparatus to saw a wafer and having a nozzle to remove burrs in scribe lanes, a method of sawing a wafer, and a semiconductor package fabricated by the same. The apparatus includes a blade to cut scribe lanes of the wafer and a burr removing nozzle disposed spaced apart from the blade. The burr removing nozzle removes metal burrs generated adjacent to the blade during cutting the wafer.