发明名称 |
CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS |
摘要 |
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die. |
申请公布号 |
EP2147463(A2) |
申请公布日期 |
2010.01.27 |
申请号 |
EP20080742558 |
申请日期 |
2008.04.04 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
ALI, MOHAMMAD ZAKI;STOLT, PETER AXEL;HAWKINS, GILBERT ALLEN;STEPHANY, THOMAS MICHAEL |
分类号 |
H01L21/60;G01N27/28;H01L21/48;H01L23/48;H05K3/10 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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