| 摘要 |
PROBLEM TO BE SOLVED: To provide a device technology for baking a wafer coated with a coating containing a solvent, which ensures that the solvent evaporates from the coating in a uniform and homogeneous manner and which avoids issues with condensation of the solvent.SOLUTION: A baking device 10 for a wafer 14 coated with a coating 15 containing a solvent is described. The device has a baking chamber 16, a support 12 for the wafer 14, an inlet 30 for a purge gas, and an evacuation 40 for the purge gas charged with the solvent evaporated from the coating 15. The inlet is formed as a diffusion element 30 placed above the wafer 14 so as to supply the purge gas evenly over substantially the entire surface of the wafer 14, and the evacuation is formed as an evacuation ring 40 which radially surrounds the diffusion element 30 and is placed at a ceiling 22 of the baking chamber 16.SELECTED DRAWING: Figure 1 |
