发明名称 COIL COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a coil component which significantly reduces parasitic capacitance, compared to a conventional coil component having a general structure.SOLUTION: A coil component includes an insulation layer and coil conductors 110 having chamfered surfaces 110a and embedded in the insulation layer to reduce parasitic capacitance between the coil conductors. The chamfered surfaces 110a are provided at both sides of a lower part surface of each coil conductor 110.SELECTED DRAWING: Figure 1
申请公布号 JP2016139784(A) 申请公布日期 2016.08.04
申请号 JP20150227886 申请日期 2015.11.20
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK SEUNG WOOK;KIM KWANG MO
分类号 H01F17/00;H01F27/28;H01F41/04 主分类号 H01F17/00
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