发明名称 |
COIL COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a coil component which significantly reduces parasitic capacitance, compared to a conventional coil component having a general structure.SOLUTION: A coil component includes an insulation layer and coil conductors 110 having chamfered surfaces 110a and embedded in the insulation layer to reduce parasitic capacitance between the coil conductors. The chamfered surfaces 110a are provided at both sides of a lower part surface of each coil conductor 110.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016139784(A) |
申请公布日期 |
2016.08.04 |
申请号 |
JP20150227886 |
申请日期 |
2015.11.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK SEUNG WOOK;KIM KWANG MO |
分类号 |
H01F17/00;H01F27/28;H01F41/04 |
主分类号 |
H01F17/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|