| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device and manufacturing method for the device, capable of improving cooling performance of a heating electronic component.SOLUTION: A power conversion device 1 includes a semiconductor module 2, a heating electronic component 3, an accommodation member 4, and a cooler 5. The cooler 5 includes a plurality of cooling pipes 51 arranged spaced apart from each other. The accommodation member 4 is constituted by a member having thermal conductivity and includes a bottom surface part and a side surface part 42 erected from the whole circumference of the bottom surface part. The semiconductor module 2, the heating electronic component 3 accommodated in the accommodation member 4, and the cooling pipes 51 are stacked and arranged. The semiconductor module 2 and the accommodation member 4 are individually held by cooling pipes 51 from both sides in a stacking direction X. The accommodation member 4 is disposed so that an erection direction of the side surface part 42 is orthogonal to the stacking direction X. A laminate 11 is pressed in the stacking direction X. The accommodation member 4 is joined to the cooler 5 by brazing.SELECTED DRAWING: Figure 1 |
