| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance heat dissipation efficiency while facilitating fixation of an LED substrate by integrating a structure for heat dissipation and a structure for fixing the LED substrate. <P>SOLUTION: The mounting device of the LED substrate is structured of a lower frame body A having a support surface of the LED substrate B and a lower sidewall 2 formed on both longitudinal sides beneath the support surface, an upper frame body C fixed on the lower frame body A, and the LED substrate B arranged on an upper surface of the lower frame body A. The both longitudinal sides of the LED substrate B are sandwiched by the upper surface of the lower frame body A and an opposite surface 4 of the upper surface of the lower frame body A formed on the upper frame body C. The LED substrate B is thermally conductive. Both of the frame bodies A, C are formed of good conductors of heat, and heat generated from an LED chip is dissipated through both of the frame bodies A, C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
