Laser annealing apparatus and laser annealing method

摘要

A laser annealing apparatus includes: a laser beam generator for providing a stable single-pulse laser; a cyclic delay unit (300) for splitting the single-pulse laser into several pulsed lasers; an optical module for converging one or more of the pulsed lasers on a substrate (204); and a movable stage (500) for providing the substrate (204) with movement in at least one degree of freedom. A laser annealing method includes: providing a stable single-pulse laser; splitting the single-pulse laser into several pulsed lasers according to a delay requirement and an energy ratio; and irradiating a substrate (204) successively with one or more of the pulsed lasers to keep a surface temperature of the wafer around the melting point or around a needed annealing temperature for a sufficiently long time during the annealing process, thus resulting in an improvement in both the laser energy utilization efficiency and effect of the annealing process.

主权项

1. A laser annealing apparatus, comprising:
a laser beam generator for providing a stable single-pulse laser beam; a cyclic delay unit for splitting the single-pulse laser beam into a plurality of pulsed laser beams; an optical module for converging one or more of the plurality of pulsed laser beams on a substrate; and a movable stage for providing the substrate with a movement in at least one degree of freedom, wherein the cyclic delay unit at least includes a delayer, a beam splitter unit and an internal control module; and the internal control module is configured to control a time delay of the delayer and a beam-splitting ratio of the beam splitter unit, and wherein the beam splitter unit includes a plurality of first beam splitters having different transmittances and a pivot; and the internal control module controls the beam-splitting ratio of the beam splitter unit by driving the pivot to switch the first beam splitter in use.