发明名称 |
Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
摘要 |
Methods of implanting boron-containing ions using fluorinated boron-containing dopant species that are more readily cleaved than boron trifluoride. A method of manufacturing a semiconductor device including implanting boron-containing ions using fluorinated boron-containing dopant species that are more readily cleaved than boron trifluoride. Also disclosed are a system for supplying a boron hydride precursor, and methods of forming a boron hydride precursor and methods for supplying a boron hydride precursor. In one implementation of the invention, the boron hydride precursors are generated for cluster boron implantation, for manufacturing semiconductor products such as integrated circuitry. |
申请公布号 |
US9455147(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201213726826 |
申请日期 |
2012.12.26 |
申请人 |
ENTEGRIS, INC. |
发明人 |
Olander W. Karl;Arno Jose I.;Kaim Robert |
分类号 |
C23C14/48;H01L21/265;H01J37/08;H01J37/317 |
主分类号 |
C23C14/48 |
代理机构 |
Hultquist, PLLC |
代理人 |
Hultquist, PLLC ;Grant Mary B.;Chappuis Maggie |
主权项 |
1. A method of implanting boron-containing ions, comprising:
ionizing a boron-containing composition comprising B2F4 under ionization conditions to generate boron-containing ions; and accelerating the boron-containing ions by electric field to implant boron-containing ions in a substrate, wherein the ionizing is conducted in a vacuum chamber containing an ion source and wherein another fluorine-containing species is introduced to said ionizing, to assist with cleaning of the vacuum chamber during said ionizing, and wherein the ionizing is conducted at an arc voltage of less than 100 volts. |
地址 |
Billerica MA US |