LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To disable a chip that does not operate normally while reducing a problem resulting from a wire connected to the chip that does not operate normally.

SOLUTION: A layered chip package 1 comprises a body 2 including a plurality of pairs of layer portions and wires 3A and 3B arranged on the side surfaces of the body 2. The plurality of pairs of layer portions includes a specific pair of layer portions 10PS having a first type layer portion and a second type layer portion. The first-type layer portion is connected to a semiconductor chip and includes a plurality of electrodes having an end surface arranged on the side surface of the body 2 but the second type of layer portion does not. A laminated body in which two or more pairs of layer portions, the number of which is determined in advance, are stacked is manufactured using a laminated foundation structure in which two foundation structures including a plurality of arranged spare layer portions are stacked and the body 2 is manufactured by stacking the first type layer portions to be added in the same number as that of the specific pairs of layer portions included therein.

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