发明名称 |
FLOW CONTROL VALVE UTILIZING THERMAL EXPANSION MATERIAL |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flow control valve utilizing a thermal expansion material to precisely regulate not only a flow rate in a micro range but also a flow rate in a wide range by utilizing a material expanded by applying heat. SOLUTION: This flow control valve comprises a body 110 provided with an inflow part 111 and a discharge part 112; a displacement control part 120, arranged at the body, to store a material expanded by a heat 125 and regulate the opening of the discharge part 112 by deforming a portion corresponding to the discharge part when an expansion material is expanded; and a heating means 130 to heat the thermal expansion material of the internal part of the displacement control part 120. The displacement control part 120 comprises a container 121 coupled to the body and storing the thermal expansion material; and a deformation plate 122 coupled to the container in a manner to correspond to the discharge part 112 and closing the container 121 and regulating the opening of the discharge part 112 displaced by expansion of the thermal expansion material.</p> |
申请公布号 |
JPH10325473(A) |
申请公布日期 |
1998.12.08 |
申请号 |
JP19970231596 |
申请日期 |
1997.08.27 |
申请人 |
SAMSUNG ELECTRON CO LTD |
发明人 |
BAEK OH-HYAN;HWANG WOONG-LIN;MOON JAE-HO |
分类号 |
F16K7/10;F16K31/02;F16K31/64;(IPC1-7):F16K7/10 |
主分类号 |
F16K7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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