发明名称 POLYPROPYLENIC RESIN COMPOSITION AND HEAT-SHRINKABLE FILM
摘要 PROBLEM TO BE SOLVED: To provide a polypropylenic resin composition capable of giving a polypropylenic resin film excellent in heat-shrinkable properties and high speed heat sealing properties within a wide temperature range enough to be suitably employed in a high speed pillow type packaging machine, a polypropylenic resin film made therefrom and a method for preparation thereof. SOLUTION: A polypropylenic resin composition comprises 10-90 wt.% of a polypropylenic resin (1) having a melting point of 130-140 deg.C, an MFR of 0.3-2.5 g/10 min and an elastic modulus in flexure of 500-1,000 MPa and 90-10 wt.% of a polypropylenic resin (2) having a melting point ranging from 135 deg.C to 150 deg.C and higher than that of the polypropylenic resin (1) by at least 5 deg.C, an MFR of 2.5-20 g/10 min and a flexural modulus of 500-1,000 MPa.
申请公布号 JP2000336221(A) 申请公布日期 2000.12.05
申请号 JP19990150012 申请日期 1999.05.28
申请人 SEKISUI CHEM CO LTD 发明人 UCHIDA KAZUHO
分类号 C08J5/18;B29C55/04;B29C61/06;B32B27/32;C08L23/12;(IPC1-7):C08L23/12 主分类号 C08J5/18
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