| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot plate in which the generation of cooling spots in a ceramic substrate can be prevented, thereby the temperature of the heated surface of the ceramic substrate can be kept uniform and a workpiece such as a silicon wafer can be heated uniformly. SOLUTION: The hot plate in which a ceramic substrate having resistive heating elements formed on the outside or inside surface of the ceramic substrate is arranged on a supporting container, is characterised in that the ceramic substrate is supported by supporting members disposed in the supporting container and the contacting portion of the supporting member and the ceramic substrate exists in the area which the resistive heating elements are formed. COPYRIGHT: (C)2005,JPO&NCIPI |
