发明名称 METHOD AND APPARATUS OF INSPECTING POSITION OF OPTICAL ELEMENT, AND FOR DIE-BONDING
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive optical element position inspecting apparatus with high position detection accuracy. SOLUTION: The position inspecting apparatus 20 emits light by supplying power to a light emitting optical element 21 by a power feeding means 23, and photographs an image of the light emitting element 21 in a light emitting condition by an imaging means 22. An image processing means 24 incorporated in the apparatus 20 sets a two-dimensional coordinate system constituted with a predetermined position on the image of the element 21 as the origin, and extracts the position selected on the image of the element 21, for example a coordinate on the two-dimensional coordinate system at the light emitting position. Further, a control unit 25 serving as a computing means incorporated in the apparatus 20 calculates the inclination of the light emission axis with respect to a two-dimensional coordinate axis based on the coordinate of the light emitting position extracted by the image processing means 24. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005235955(A) 申请公布日期 2005.09.02
申请号 JP20040041942 申请日期 2004.02.18
申请人 SHARP CORP 发明人 TAGASHIRA HIROSHI;MIHASHI YOSHIZO;HORIO TAKAAKI;TATSUTA HIDEAKI
分类号 H01S5/022;(IPC1-7):H01S5/022 主分类号 H01S5/022
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