| 摘要 |
PROBLEM TO BE SOLVED: To provide a feedback method of a semiconductor manufacturing step that can improve productivity without setting conditions in advance using advancing wafers, in a situation that the microfabrication of a device dimension progresses, required dimensional accuracy and alignment accuracy become higher, and the number of processings in a lithography step increases as processes become complicated. SOLUTION: The feedback method is used to determine the processing condition of a lot to be processed according to in-step process quality control data of several lots that are processed in the lithography step of the manufacturing process of a semiconductor device. When the processing condition is determined, the in-step process quality control data are examined by a statistical examination method, the change of the condition is accurately grasped on the basis of the examination result, and the in-step process quality control data used for the determination of the processing condition are selected. Thus, a new regression coefficient is obtained, and feedback is conducted on the basis of the regression coefficient. COPYRIGHT: (C)2005,JPO&NCIPI
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