| 摘要 |
The device has units (34) constituted of sliding and guiding units (32), to effect a relative transversal displacement between an assembly of sawn wafers (30) and a set of wire saws (15) along a cutting direction (Y), so that the saws cut and separate the sawn wafers in the device. The sawn and cut wafers are directly introduced into a wafer receiving receptacle (41) provided with separation units (43).
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