| 摘要 |
PROBLEM TO BE SOLVED: To provide an MEMS element which is excellent in moisture resistance and improves the reliability, and the manufacturing method for the MEMS element. SOLUTION: The MEMS element 1 is equipped with a wiring part 40 wherein a structure body 18 is formed on a semiconductor substrate 10, and a wiring 21 and interlayer insulating films 20, 22 overlie the peripheral part of the structure body 18 so as to enclose the structure body 18. Guard rings 31, 33, 35 of the shape enclosing the structure body 18 in the plan view are formed between respective films composing the wiring part 40, and penetration guard rings 30, 32, 34 whose whole periphery contacts the guard rings 31, 33, 35 which pass through respective films, and are vertically positioned are formed. The wiring 21 disposed on the wiring part 40 is disposed outside of respective guard rings 31, 33, 35 and respective penetration guard rings 30, 32, 34. COPYRIGHT: (C)2006,JPO&NCIPI
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