| 发明名称 |
METHOD OF COATING FINE WIRES AND CURABLE COMPOSITION THEREFOR |
| 摘要 |
<p>A method of reducing wire sweep and shorting during fabrication of a semiconductor device includes spraying a curable composition onto wire bonds, and free-radically B-staging the curable composition, and then thermal curing to a C-stage. A sprayable curable composition is also disclosed.</p> |
| 申请公布号 |
KR20100095014(A) |
申请公布日期 |
2010.08.27 |
| 申请号 |
KR20107015654 |
申请日期 |
2008.11.13 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
KROPP MICHAEL A. |
| 分类号 |
H01L23/29;C08J3/24;C08L63/00 |
主分类号 |
H01L23/29 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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