| 摘要 |
<p>A side view light emitting diode package and fabrication method thereof are provided to make a light emitting device thin and small by removing the lead frame and using a plate electrode as an electrode pattern. Two electrode patterns(130) are separated from each other. The LED chip(120) is formed in the spacing region of the electrode pattern. The wire(160) connects the LED chip with electrode pattern. The molding material(110) covers the electrode pattern, and the LED chip and wire. The molding material includes a reflective material. The hole(140) is formed in the electrode pattern.</p> |
