| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor module capable of mounting a semiconductor chip on a wiring board without damaging the fluidity of an underfill agent due to a wiring pattern. SOLUTION: A mounting region A on which a semiconductor chip is to be mounted is predetermined on a mounting surface of a wiring board 12, wiring patterns 18, 20 are formed such that they radially extend from the approximately central position of the mounting region A. The underfill agent 16 is adhered to the approximately central position of the mounting region A in a flowable state, the underfill agent 16 is pushed and spread while pressing the semiconductor chip 14 from the upper side. In this case, the fluidity of the underfill agent 16 is not damaged because wiring patterns 18, 20 are radially formed. COPYRIGHT: (C)2009,JPO&INPIT |
