| 摘要 |
A device for pressing on semiconductor chips situated on a substrate comprises a substrate support and a tool movable in relation to the substrate support in a predetermined movement direction, which has multiple pressing plungers mounted so that they are displaceable in the movement direction of the tool for pressing on the semiconductor chips. The tool has a pressure chamber to which compressed air may be applied. All pressing plungers are situated along a straight line. Each of the pressing plungers has a bar running perpendicularly to the movement direction of the tool and perpendicularly to the cited straight line on its end facing toward the pressure chamber. Pistons are situated in the area between the pressure chamber and the pressing plungers, which are displaceable in the movement direction of the tool. One side of the pistons is subjected to the pressure existing in the pressure chamber and the other side rests on one of the bars of the pressing plungers.
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