发明名称 SPUTTERING APPARATUS
摘要 <p>Provided is a sputtering apparatus having improved service life, with suppressed local consumption at an end portion in the axis direction of a rotatable cylindrical target and with uniformized erosion region in the cylindrical target. The apparatus is provided with a pair of sputtering vapor sources (2) having rotatable cylindrical targets (13) and magnetic field generating members (14) arranged inside the targets, respectively; and a sputter power supply (3) for supplying the apparatus with discharge power by having the cylindrical targets (13) as cathodes. The cylindrical targets (13) are arranged so that the center axes are parallel to each other, and the magnetic field generating members (14) generate magnetic fields which pass the surfaces of the cylindrical target (13) and have magnetic lines attracting each other.</p>
申请公布号 WO2009013935(A1) 申请公布日期 2009.01.29
申请号 WO2008JP59880 申请日期 2008.05.29
申请人 KABUSHIKI KAISHA KOBE SEIKO SHO;TAMAGAKI, HIROSHI 发明人 TAMAGAKI, HIROSHI
分类号 C23C14/35 主分类号 C23C14/35
代理机构 代理人
主权项
地址