发明名称 |
Through-Chip Via Interconnects for Stacked Integrated Circuit Structures |
摘要 |
A stacked IC structure has an integrated circuit (IC) having a front IC side, a back IC side, and a first conductive feature formed on the front IC side. A through-chip via connects to the first conductive feature on the front IC side. A substrate has an external circuit formed on a front surface. The IC attaches to the front surface of the substrate and the through-chip via forms a connection between the first conductive feature and the external circuit.
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申请公布号 |
US2009057872(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20070847239 |
申请日期 |
2007.08.29 |
申请人 |
EHLERS ERIC R;CLATTERBAUGH JIM;BONSE MATHIAS;SHIRLEY TIMOTHY E;ORR JERRY R |
发明人 |
EHLERS ERIC R.;CLATTERBAUGH JIM;BONSE MATHIAS;SHIRLEY TIMOTHY E.;ORR JERRY R. |
分类号 |
H01L23/52;H01L21/00;H01L23/04 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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