| 摘要 |
The purpose of the present invention is to provide a grinding wheel capable of achieving any one among reducing a process load, improving heat radiation, and lengthening life time. Provided is a grinding wheel (37, 47) including diamond abrasive grains and a boron compound at a predetermined volume ratio, and grinding a workpiece. An average grain diameter (X) of the diamond abrasive grains satisfies 0 m < Y <= 50 m, and an average diameter ratio (Z) of the boron compound to the diamond abrasive grains satisfies 0.8 <= Z <= 3.0. Desirably, the workpiece is a Si wafer and the average diameter ratio (Z) satisfies 0.8 <= Z <= 2.0. |
