TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

摘要

A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

主权项

1. A silicon condenser microphone package comprising:
a transducer unit; a substrate including an upper surface having a recess formed therein, the transducer unit attached to the upper surface of the substrate overlapping at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate; and a cover placed over the transducer unit, the cover including an aperture.