发明名称 FLEXIBLE WIRING BASE MATERIAL AND WIRING BOARD, AND SOLAR CELL MODULE AND IC CARD
摘要 PROBLEM TO BE SOLVED: To provide a layer structure of a flexible wiring base material which allows for formation of a fine cut line, with high location accuracy, in a metal foil part without causing any significant damage to an insulating base material, when laying a metal wiring pattern on the insulating base material by half-cutting method.SOLUTION: A flexible wiring base material 1 consists of a metal foil 2, a base material 4 and one or more adhesive layers 3 for bonding them, where the Vickers hardness of all adhesive layers 3 is lower than that of the base material, and the Vickers hardness of at least one adhesive layer 3 is 1 or more. A flexible wiring board 10 is obtained by half-cutting the flexible wiring base material, and exfoliating the unnecessary metal foil part 2a.SELECTED DRAWING: Figure 1
申请公布号 JP2016184596(A) 申请公布日期 2016.10.20
申请号 JP20130169474 申请日期 2013.08.19
申请人 TOPPAN PRINTING CO LTD 发明人 KUDO SHIGEKI;YAMAMOTO MAYUMI;TAKAHASHI WATARU
分类号 H05K1/03;G06K19/07;G06K19/077;H01L31/042;H05K3/04 主分类号 H05K1/03
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