BLACK TITANIUM OXYNITRIDE POWDER, AND SEMICONDUCTOR SEALING RESIN COMPOUND USING SAME

摘要

This black titanium oxynitride powder for use in a semiconductor sealing resin compound is coated on a surface thereof by a silica film having a thickness of 2.5-12 nm. The black titanium oxynitride powder has a volume resistivity of at least 1×10 5 ©·cm when in a state of pressurized powder body formed by compacting the powder at a pressure of 5 MPa. Moreover, the lightness index L* value of the black titanium oxynitride powder in the CIE 1976 L*a*b* color space (measurement light source C: color temperature 6774K) is 14 or less.