发明名称 |
Micromechanical measuring element and method for producing a micromechanical measuring element |
摘要 |
A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening. |
申请公布号 |
US9506831(B2) |
申请公布日期 |
2016.11.29 |
申请号 |
US201314383857 |
申请日期 |
2013.03.08 |
申请人 |
EPCOS AG |
发明人 |
Schiffer Michael;Peschka Andreas;Zapf Jörg;Weidner Karl;Hedler Harry |
分类号 |
G01D11/24;G01L19/14;B81B7/00;B23K1/00;G01P1/02 |
主分类号 |
G01D11/24 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A micromechanical measuring element, comprising:
a carrier; a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection; elastomer bodies arranged between the sensitive element and the first and second solder connections; and a metallization arranged between the elastomer body and the first solder connection, wherein the metallization has a meandering or helical shape, and wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening. |
地址 |
Munich DE |