发明名称 Micromechanical measuring element and method for producing a micromechanical measuring element
摘要 A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.
申请公布号 US9506831(B2) 申请公布日期 2016.11.29
申请号 US201314383857 申请日期 2013.03.08
申请人 EPCOS AG 发明人 Schiffer Michael;Peschka Andreas;Zapf Jörg;Weidner Karl;Hedler Harry
分类号 G01D11/24;G01L19/14;B81B7/00;B23K1/00;G01P1/02 主分类号 G01D11/24
代理机构 Slater Matsil, LLP 代理人 Slater Matsil, LLP
主权项 1. A micromechanical measuring element, comprising: a carrier; a sensitive element connected to the carrier by a first solder connection and a second solder connection, wherein the sensitive element is electrically contacted by the first solder connection; elastomer bodies arranged between the sensitive element and the first and second solder connections; and a metallization arranged between the elastomer body and the first solder connection, wherein the metallization has a meandering or helical shape, and wherein the sensitive element, the carrier and the second solder connection form a first chamber, the first chamber having a first opening.
地址 Munich DE