| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit, preventing a damage of a cover insulating layer or a conductor patten during insertion into an E block, and also to provide its manufacturing method. <P>SOLUTION: The suspension substrate 1 with a circuit is equipped with: a metal support substrate 6, a base insulating layer 7 formed on the substrate 6; a conductor pattern 8 formed on the layer 7; a cover insulating layer 9 formed on the base insulating layer 7 to cover the conductor pattern 8; and an insertion part 5 inserted into the E block. The thickness T1 of the cover insulating layer 9 in the insertion part 5 is set larger than the thickness T2 of the cover insulating layer 9 in a part other than the insertion part 5. <P>COPYRIGHT: (C)2010,JPO&INPIT |
