RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

摘要

The problem of the invention is to provide a resin composite electrolytic copper foil having further improved heat resistance and improved plate adhesion strength when plated after desmear treatment in the work process of an additive method.;The solution is to form a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 μm to 3.0 μm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and form a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface.

主权项

1. A resin composite electrolytic copper foil prepared by forming a roughened surface having a plurality of minute projections, a surface roughness (Rz) within a range of 1.0 μm to 3.0 μm and a lightness value of not more than 30 on one surface of an electrolytic copper foil (A), and forming a layer of a resin composition (B) containing a block copolymerized polyimide resin (a) having a structure that imide oligomers of a first structural unit and a second structural unit are bonded alternately and repeatedly on the roughened surface,
wherein a measurement method of the lightness value is a method of irradiating a measurement sample surface and measuring a light reflection amount to be represented as a lightness value, the minute projections have a plurality of bored portions on the lateral when seen in the cross sectional surface along the thickness direction of the electrolytic copper foil, and the minute projections are located by 200 to 25000 in an area of 100 μm×100 μm, in the roughened surface, the volume of a pore with a pore diameter of 100 to 1000 nm is not less than 0.1 mL/m2, the block copolymerized polyimide resin (a) is a block copolymerized polyimide resin (a) having a block of the general formula (1) as a structural unit and a block of the general formula (2) as a structural unit, in the formulae, m and n are each not less than 2, and m:n=1:9 to 3:1, and the resin composition (B) contains an inorganic filler (b).