RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINT WIRING BOARD USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for multilayer printed wiring boards which is excellent in heat resistance and electrical properties and a multilayer printed wiring board using the same. SOLUTION: There is provided a resin composition for multilayer printed wiring boards which comprises an alkenylphenol compound (1), a maleimide compound (2) and 5-70 pts.wt., per 100 pts.wt. total of compounds (1) and (2), compound (3) which is decomposed or dissolved by the action of a roughening agent.