SUBSTRATE TREATMENT DEVICE AND SCATTER PREVENTING CUP

摘要

PROBLEM TO BE SOLVED: To prevent the electric leak generated by the scatter of cleaning liquid outside a cup and the contamination of a substrate generated by the splash of the cleaning liquid in a rotating substrate treatment device. SOLUTION: A cleaning liquid such as pure water is supplied from a nozzle onto the upper face of a substrate W retained by a chuck 50 and rotated to rotate and clean the substrate W. The cleaning liquid splashed from the surface of the substrate W by the rotation centrifugal force collides with an inner wall face 11 of an upper cup 10 and bounces back. The oblique angleθof the inner wall face 11 to the substrate W is set in the range of 30 deg.C-60 deg.C, and the range of angle is determined by the actual measurement. Used cleaning liquid is not formed into mist hung over outside the cup nor bounced droplets onto the substrate W, but are dropped downward in the cup and collected on the lower section of the cup by adopting the above range of angle. The leak from an electric system and the contamination of the substrate outside the cup can be prevented by the arrangement.