| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress leakage of a sealant when forming the seal. <P>SOLUTION: A wiring mother board 31 is first prepared, with which a product forming part is formed, to be a wiring board of a semiconductor device. A semiconductor chip 15 is mounted in the product forming part, and on a chip mounting side of the wiring mother board, where the semiconductor chip is mounted, a pressure contact member 51a is mounted in pressure contact with an inner surface of a molding metal die 70 molding the wiring mother board. Thereafter, the wiring mother board is molded with the molding metal die such that a surface 93 of the wiring mother board opposite to the chip mounting side and the pressure contact member are brought into pressure contact by the molding metal die. The inside of the molding metal die is then filled with the sealant 18. <P>COPYRIGHT: (C)2010,JPO&INPIT |
