发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device which is excellent in heat release property and orientation property and a method for manufacturing the light emitting device for easily manufacturing the light emitting device which is satisfactory in heat release property. <P>SOLUTION: A light emitting device 100 is manufactured by a manufacturing method having a first process to electrically connect a lead electrode 102 to a light emitting element 110 by mounting a flip flop type light emitting element 110 on a pedestal 101 having the lead electrode 102; a second process to place resin 120 containing phosphor 140 on the upper surface of the light emitting element 110; a third process to coat the placed resin 120 with a coating member 130, and to spread the resin 120 to the periphery of the light emitting element 110; a fourth process to pressure-reduce the inside of a space coated with the coating member 130 and the pedestal 101, and to make the resin 120 enter a clearance part other than a part electrically connecting the light emitting element 110 to the lead electrode 102; and a fifth process to harden the resin 120 arranged in the periphery of the light emitting element 110. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP4543712(B2) 申请公布日期 2010.09.15
申请号 JP20040076687 申请日期 2004.03.17
申请人 发明人
分类号 H01L33/54;H01L33/32;H01L33/38;H01L33/50;H01L33/56;H01L33/62 主分类号 H01L33/54
代理机构 代理人
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