| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which is capable of reducing a waste of a gap between interposers stacked up in layers so as to improve chip parts in mounting density, and lowering a module composed of the same number of the interposers in mounting height. SOLUTION: The semiconductor integrated circuit device is composed of the interposers 2 (2a to 2e) which are each mounted with semiconductor chips 6a and 6b and/or electronic parts 7 and stacked up in layers through the intermediary of interlayer connection terminals 9 electrically connected to interlayer connection lands 3 formed on the interposers 2. The interposers 2 stacked up in layers are alternately and obliquely stacked up, and a gap between the interposers 2 that confront each other in a vertical direction is set wider at one side than at the other side. The interlayer connection terminals 8a and 8b of different heights are used to make the interposer 2 slant, the low interlayer connection terminal 8b is provided between the interposers 2 at one side, and the high interlayer connection terminal 8a is provided between the interposers 2 at the other side. COPYRIGHT: (C)2005,JPO&NCIPI
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