| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection apparatus, capable of precisely measuring automatically and analyzing at least the stress and film thickness at a prescribed measuring point in each of all the manufactured semiconductor substrates, so as to contribute to the establishment of a substrate production process of high performance and high productivity. SOLUTION: This inspection device is provided with a conveying device for conveying a measuring objective wafer 3 onto a movable sample block 4, an optical microscope 10 for observing the measuring point P on a wafer 3 surface on the sample block 4, an ellipsometer optical system 40 for emitting multi-wavelength of a polarized light L<SB>3</SB>to the measuring point P to output information as to the wafer surface, a Raman spectroscopic optical system 40 for emitting a laser beam to the measuring point P on the wafer 3 to output other information as to the wafer 3, and a computer 60 for analyzing physical information, such as film thickness, refractive index, stress and composition to be output, based on the informations provided hereinbefore. COPYRIGHT: (C)2005,JPO&NCIPI
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