| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability, and to provide a manufacturing method thereof. <P>SOLUTION: The method of manufacturing a semiconductor device, includes mounting a semiconductor chip 20 having an electrode 25 on a wiring substrate 10 having a base substrate 12 and a wiring 14 formed on the base substrate 12, allowing the wiring 14 to contact the electrode 25 and heating and pressurizing them to form an eutectic alloy 30. In this case, the eutectic alloy 30 is formed so that its one part enters in between the wiring 14 and the base substrate 12. <P>COPYRIGHT: (C)2007,JPO&INPIT |
