| 发明名称 |
CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS |
| 摘要 |
A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.
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| 申请公布号 |
US2008318494(A1) |
申请公布日期 |
2008.12.25 |
| 申请号 |
US20070765815 |
申请日期 |
2007.06.20 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HU TIEN-CHEN;HOU JUNG-SHENG;HUANG CHUN-CHIN |
| 分类号 |
B24B7/20 |
主分类号 |
B24B7/20 |
| 代理机构 |
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代理人 |
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