发明名称 |
INTERCONNECT STRUCTURES WITH ENCASING CAP AND METHODS OF MAKING THEREOF |
摘要 |
A method of making an interconnect comprising: providing an interconnect structure in a dielectric material, recessing the dielectric material such that a portion of the interconnect structure extends above an upper surface of the dielectric; and depositing an encasing cap over the extended portion of the interconnect structure.
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申请公布号 |
US2008318415(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20080199407 |
申请日期 |
2008.08.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WONG KWONG HON;HSU LOUIS C.;DALTON TIMOTHY J.;RADENS CARL;YANG CHIH-CHAO;CLEVENGER LAWRENCE A.;STANDAERT THEODORUS E. |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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