| 摘要 |
The present invention relates to a substrate polishing apparatus and a method thereof. More specifically, the present invention relates to a substrate polishing apparatus to polish objects with a constant pressure even though a weight of lighting devices where a polishing wheel wears out are changed. According to the present invention, the substrate polishing apparatus comprises: a table to mount a substrate; a polishing wheel which polishes an edge or side of the substrate; spindles which drive the polishing wheel; and a pressure control unit which moves the polishing wheel in a horizontal direction, controlling a polishing pressure. |
