SUPPORT GLASS SUBSTRATE AND LAMINATE COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To contribute to high density mounting of a semiconductor package by creating a support substrate which prevents dimensional change of a processed substrate when the proportion of semiconductor chips is high and the proportion of sealing materials is low in the processed substrate, and a laminate comprising the same.SOLUTION: A support glass substrate according to the present invention has an average linear thermal expansion coefficient of more than 30×10/°C and less than 50×10/°C in the temperature range of 30-380°C, and a total plate thickness deviation of less than 2.0 μm.SELECTED DRAWING: Figure 1