发明名称 |
DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES |
摘要 |
A device for liquid treatment of a wafer-shaped article comprises a closed process chamber, and a ring chuck located within the closed process chamber. The ring chuck is adapted to be driven without physical contact through a magnetic bearing. A magnetic stator surrounds the closed process chamber. The closed process chamber has a cylindrical wall positioned between the ring chuck and the magnetic stator during liquid treatment of a wafer-shaped article. Various structures are provided to prevent upward ingress of processing liquid into a gap defined between the ring chuck and the cylindrical wall. |
申请公布号 |
SG10201604412R(A) |
申请公布日期 |
2016.07.28 |
申请号 |
SG10201604412R |
申请日期 |
2012.05.24 |
申请人 |
LAM RESEARCH AG |
发明人 |
LACH, OTTO;TSCHINDERLE, ULRICH;JUNK, MARKUS |
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