发明名称 COMPOSITION FOR COPPER FILM FORMATION, AND PRODUCTION METHOD OF COPPER FILM
摘要 PROBLEM TO BE SOLVED: To provide a composition for copper film formation convertible into a copper film excellent in storage stability and coating performance, and excellent in conductivity at a low temperature.SOLUTION: A composition for copper film formation uses (A) copper formate or its hydrate, (B1) a monoamine compound and (B2) a diamine compound as raw materials, and is formed by mixing, in terms of anhydride, the total amount of the component B1 and the component B2 in the range of 2.05 pts. mol to 10 pts. mol with the 1 pt. mol component A, on condition that the mol ratio {B2/(B1+B2)} of the component B2 to the total mol amount of the component B1 and the component B2 is in the range of 0.03-0.40, and by generating the reaction at 80°C or lower.SELECTED DRAWING: None
申请公布号 JP2016138297(A) 申请公布日期 2016.08.04
申请号 JP20150012556 申请日期 2015.01.26
申请人 NIPPON STEEL & SUMIKIN CHEMICAL CO LTD 发明人 FUJISHIRO KOICHI;YOSHIOKA TAKAHIRO;YAMAMOTO YOSHINARI
分类号 C23C18/08 主分类号 C23C18/08
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